Facilities

The nano-mechanical testing equipment includes:

• three ex-situ (in air) nanoindentation systems,
• two in-situ nano-mechanical test systems that work in conjunction with a scanning electron microscope (SEM).

The thin film deposition system consists:

• the SwissCluster-1, a modular thin film deposition system capable of synthesizing atomic layer deposition (ALD) and physical vapor deposition (PVD) layers to fabricate unique microstructure.

These instruments were funded through the ISU Cost Sharing Program for Research Tools – CoSPRT, 2021 DURIP (ARO) grant, 2017 NSF Major Research Instrumentation (MRI) grant #1726897, DOE Scientific Infrastructure Support for Consolidated Innovative Nuclear Research, and the 2017 LANL Laboratory Education Equipment Gift (LEEG) program.

• Well-developed methods for characterizing material properties of small material volumes.
• Elastic modulus and hardness of metals, ceramics, other hard materials, and thin films.
• Viscoelastic properties of materials using harmonic loading.
• Time-dependent properties are under constant load (creep response) or displacement (relaxation response).
• Fracture behavior of thin films and brittle materials.
• Scratch testing to determine film adhesion, coefficient of friction, and a variation of properties with depth.
• NanoVision Option probes the surface of a sample, generating a 3D map of the surface.
• Multiple probe geometries – Berkovich, Vickers, cube-corner, spherical, flat punch, etc.
• Capable of dynamic properties characterization via continuous measurement of stiffness (CSM) with indentation depth.

Funding acknowledgement:
NSF-CMMI (EAGER) Award #1541918 Equipment Supplement grant, and Los Alamos National Laboratory Education Equipment Gift Program (LEEG).

• Superior Control and Sensitivity: Bruker’s performance-leading feedback control algorithms and superior measurement sensitivity provide precise control for all Hysitron nano-mechanical testing techniques.
• Nanoscale dynamic mechanical analysis (nanoDMA® III) to measure viscoelastic properties at the molecular level, on individual polymer phases, and on polymeric interfaces.
• NanoDMA® III, combined with temperature control capabilities, can perform time-temperature-superposition studies on nanoscale volumes of material.
• Interfacial adhesion property characterization of thin-film/substrate systems through the identification of delamination events.
• Scratch testing to better understand fundamental tribological properties, including nanoscale wear and friction properties within and across individual phases and components.
• Capacitive Transducer Technology: Proprietary capacitive transducer technology provides unprecedented measurement sensitivity (<30 nN, <0.2 nm), accuracy, and reliability during the nanoindentation process. Electrostatic actuation uses little current, enabling superior drift characteristics that result in faster data acquisition, higher accuracy, and better repeatability.
• Creep and stress relaxation measurements made possible due to tight feedback control algorithms.
• High-Resolution Optics with In-Situ SPM Imaging: Top-down optics with a color CCD camera have been incorporated into the Hysitron TI 950 TriboIndenter for high magnification and visual observation of sample surfaces and the selection of testing locations. For greater precision in probe placement, in-situ SPM imaging can be used to refine the probe position to within ±10 nm. The dual modes of imaging provided by the Hysitron TI 950 allow precise positioning of the probe to accommodate the multitude of applications for which it is used.

• Quantitative measurement of nano-mechanical properties, including hardness, stiffness, and modulus
• Hysitron’s patented transducer provides electrostatic actuation and capacitive displacement sensing
• Multiple control modes, including closed-loop displacement control, closed-loop load control, and open-loop load
  control.
• Modes of mechanical testing include indentation, compression, bend, and tensile.
• Proprietary Q-Control mode actively dampens transducer oscillations.
• Multiple modes of mechanical testing include indentation, compression, bend, tensile, and fatigue.
• Interchangeable probes are available in various geometries to meet the demands of different test types.
• In-Situ Mechanical Testing at Extreme Temperatures, Nanoindentation + Heating up to 800°C (optional).
• The NanoDynamic™ mode provides sinusoidal loading at frequencies up to 300 Hz to evaluate the time-dependent response of a broad range of materials.

• This is a unique system (and different from other manufacturers) because it is a depth-controlled system. Most nano-mechanical systems are load controlled. Being depth-controlled it will allow us to perform high strain rate measurements (up to 1000/s strain rates). There is also the possibility of reaching higher strain rates in the future. High strain rate measurements allow us to perform strain rate jump tests and measure activation energies and activation volumes from sub-micrometre-sized specimens. No other manufacturer (the US or non-US) has this capability.
• Ability to combine with other techniques like EBSD, synchrotron x-rays, micro-Raman, etc.
• Ability to perform mechanical tests in a low vacuum environment for imaging non-conductive samples.
• Ability to operate as a standalone instrument under an optical microscope (when the SEM is booked/unavailable).
• A small, compact, portable system that can be moved between labs/buildings.
• True displacement control mode for studying stable crack propagation in fracture, stress relaxation, etc.
• Covering a wide load range from 4µN up to 1.5N.
  
• Ability to perform under cryo- (down to -150^oC) and elevated (up to 1000^oC) temperatures.

• InForce 1000 actuator for capacitance displacement measurement and electromagnetic force actuation with interchangeable tips
• InQuest high-speed controller electronics with 100kHz data acquisition rate and 20µs time constant
• XY motion system with easy mounting magnetic sample holder
• High stiffness gantry with integrated vibration isolation
• Integrated microscope with digital zoom for precise indentation targeting
• ISO 14577 and standardized test methods
• InView software package with RunTest, ReviewData, InFocus reporting, InView University online training and InView mobile application

• Capable of gradient and elevated temperature deposition up to 400°C
• In-situ stress measurement system for measuring the curvature during deposition
• Up to 12 precursors with individual inlets for a wide variety of ALD depositions
• Up to 4 magnetrons with 2 in. targets for multielemental or multialloy deposition
• Modular components for individual processes, and customizable panels for viewports and other in-situ analysis equipment
• Compact cluster design allows for ease of installation and maintenance
• High power impulse magnetron sputtering (HiPIMS) compatible
• System base PVD pressure or 5 x 10^-7 mbar and 5 x 10^-3 mbar for clean deposition
• Optical emission spectroscopy compatible for process analytics and optimizing recipes

The metallographic sample preparation equipment includes:

• mechanical polishers,
• vibratory polisher,
• electrolytic polisher,
• inverted metallurgical microscope.

• Twin base grinder-polisher with a speed range of 50-500 rpm.
• Adjustable water flow nozzle and built-in drain.
• Easy-to-use control panel.
• Quick access to an emergency stop.

• External control box for protection of critical components.
• Clockwise and counterclockwise platen rotation.
• Variable platen jog speed: 40-600 rpm.
• Programmable up to 25 polishing steps.
• Corrosion/impact-resistant cover.

• Automatic, microprocessor-controlled machine for grinding and polishing of specimens.
• 250 mm MD-Disk with cone.
• Method database for materials.
• Advanced dosing functions ensure constant dosing levels of diamond suspension and lubricant.

• Frequency Controller
• Voltage controller
• Multiple size holders (1-inch up to 2-inch diameter)
• Timer control

• Fully Automatic, microprocessor-controlled electrolytic polishing and Etching apparatus.
• Scanning function for determination of parameters.
• Includes method database for a wide range of materials, which can be used as starting points for developing methods for other materials.

• GX51 is available for brightfield, darkfield, DIC, and simple polarization observations.
• Switching between brightfield and darkfield is simple and easy with ergonomic efficiency.
• Operator controls are located in front of the frame for ease of operation and user comfort when inspecting large numbers of samples.
• Excellent Image Clarity and Superb Resolution.
• UIS2 optics delivers bright, sharp, high-resolution images suitable for all observation methods: brightfield, darkfield, differential interference contrast, polarization, and fluorescence.
• Designed with specific wavefront aberration controls and speciality coatings for color fidelity, UIS2 optics ensure images are true to form and highly resolved.